NextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to focus on advancing hybrid electronics for industrial and medical applications. Visionary speakers will guide participants toward opportunities in both technology advancement and education and workforce development. The workshop will build on NextFlex’s ongoing efforts to advance additive electronics packaging technologies and will include a review of the hybrid electronics manufacturing roadmaps, the state-of-the-art achieved through funded development projects, manufacturing capabilities across the US, and the strategy behind the NextFlex education and workforce development programs. Finally, this workshop will provide opportunities to provide in-person feedback on PC 9.0 topics during member-only breakout sessions.